Amanda Newman on LinkedIn: Nvidia Accelerates AI Chip Production with New Packaging Tech to Meet… (2024)

Amanda Newman

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NVIDIA plans to expedite the adoption of Fan-Out Panel Level Packaging (#FOPLP) technology for its GB200 AI server chips to alleviate production constraints associated with Chip on Wafer on Substrate (#CoWoS) packaging at Taiwan Semiconductor Manufacturing Co (TSMC). FOPLP is seen as a viable alternative due to TSMC's limited CoWoS capacity and the increasing demand for #AI chips. Industry experts suggest that FOPLP could offer cost reductions and enhanced capacity despite its weaker technical specifications compared to CoWoS. Packaging companies are gearing up to provide FOPLP services, with market share expected to grow significantly by 2028. Nvidia's embrace of FOPLP aligns with its strategy to meet soaring demand for #AI chips, positioning it as a leading supplier in the accelerated compute and Gen AI space.Follow Amanda Newman to stay up to date with technology.https://lnkd.in/egbkv2KF

Nvidia Accelerates AI Chip Production with New Packaging Tech to Meet Soaring Demand msn.com

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  • Amanda Newman

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